We provide tungsten steel and high speed steel POT and PLUNGER. Widely used in semiconductor/package multi-cavity molds. The inner hole roughness by special grinding treatment can reach Ra0.01, roundness 0.0004, and cylindricity 0.002. The following series of cartridge PLUNGER are available for different mold and packaging process characteristics:
Conventional structure, tungsten steel PLUNGER
Special self-sealing structure, tungsten steel PLUNGER
Specially coated PLUNGER
High-speed steel  PLUNGER with sealing ring and special coating on the surface
Performance: high precision, high wear resistance, high stability